Most Complex Silicon Phased Array Chip in the World

UC San Diego electrical engineers have developed the world's most complex "phased array" -- or radio frequency integrated circuit. This DARPA-funded advance is expected to find its way into U.S. defense satellite communication and radar systems. In addition, the innovations in this chip design will likely spill over into commercial applications, such as automotive satellite systems for direct broadcast TV, and new methods for high speed wireless data transfer.

"This is the first 16 element phased array chip that can send at 30-50 GHz. The uniformity and low coupling between the elements, the low current consumption and the small size - it is just 3.2 by 2.6 square millimeters - are all unprecedented. As a whole system, there are a number of a number of firsts," said Gabriel Rebeiz, the electrical engineering professor from the UCSD Jacobs School of Engineering leading the project. The work was done by two graduate students, Kwang-Jin Koh and Jason May, both at the Electrical and Computer Engineering Department (ECE) at UCSD. Rebeiz presented the new chip at DARPA TEAM Meeting, August 28-29, 2007 in Chicago, Illinois. Additional details of the chip will be submitted to an academic journal later this year.



This chip - the UCSD DARPA Smart Q-Band 4x4 Array Transmitter - is strictly a transmitter. "We are working on a chip that can do a transmit and receive function," said Rebeiz.........